The requirements of stamping processing for PC board, PC board is widely used in all walks of life, has become a hot decoration. In the actual processing of this kind of plate, there are strict requirements for the thickness of PC plate in stamping process. In short, the stamping process of PC board can not only extend the service life of the board, but also increase the application effect of the board.

Requirements of stamping process for PC board

(1) Hydraulic press: the thickness of stamping plate is limited. The stamping range of plate is within 1.5mm. If there are special requirements, the plate with thickness of 2mm or more can also be punched. But with the rapid rise of stamping cost, due to the increase of sheet thickness, the life cycle of tool die will be reduced, and the cost of replacing tool die will also increase.

(2) The limitation of stamping on the material of PC board: the stamping process of PC board not only limits the thickness of the material itself, but also the plate. In fact, not all the plates will adopt the stamping process. Note that the requirement of stamping is that the plate itself must have a certain toughness.

(3) Advantages of stamping: PC board stamping is mainly because it can be large-scale, mass production, but also to ensure that mass production process, all products can maintain consistency, so that each product remains the same. If customers choose poor quality plate, there will be many holes on the surface, similar to this situation, it is recommended to use stamping process for processing, and finally form high-quality plate. In a word, stamping is a good way to make PC board have good practical application effect.